Flexible Heat Exchanger

ABSTRACT

An embodiment of the invention comprises a method for constructing a heat exchanger for cooling one or more semiconductor components. The method comprises the step of providing first and second planar sheets of specified thermally conductive metal foil, wherein each of the sheets has and exterior side and an interior side. The method further comprises forming one or more thermal contact nodes (TCNs) in the first sheet, wherein each TCN extends outward from the exterior side of the first sheet, and comprises a planar contact member and one or more side sections, the side sections respectively including resilient components that enable the contact member of the TCN to move toward and away from the exterior side of the first sheet, and the side sections and contact member of a TCN collectively forming a coolant chamber. Channel segments are configured along the interior side of the first sheet, wherein each channel extends between the coolant chambers and two TCNs, or between the coolant chamber of a TCN and an input port or output port, selectively. The method further comprises joining the interior side of the second sheet to the interior side of the first sheet, in order to form a sealed flow path that includes each channel segment, and enables liquid coolant to flow into and out of the coolant chamber of each TCN.

BACKGROUND

1. Field of the Invention

The disclosure relates generally to a liquid flow through (LFT) heatexchanger for cooling printed circuit boards (PCB) devices, or othersemiconductor devices or components. More specifically, the inventionpertains to a heat exchanger of the above type that is very flexible andmay be readily adapted for use with semiconductor devices of varyingheights or other dimensions.

2. Description of the Related Art

High performance computing systems are using ever increasing amounts ofpower at higher power densities. As a result, system coolingrequirements have become more challenging, and it is necessary toconsider solutions that use liquid cooling. Currently available liquidcooling approaches include heat pipe, vapor chamber, and liquid flowthrough (LFT) solutions. These solutions, however, tend to be quitecostly.

In a system that uses liquid cooling, it may also be necessary to placecomponents for removing heat in physical contact with semiconductordevices located on a PCB assembly or the like. However, adjacentsemiconductor devices may be of different sizes. Moreover, twosemiconductor devices that are of the same type may in fact have adimension that is different for the two devices, even though suchdimension is within the allowed tolerance for both devices. As a result,it may be difficult to provide heat exchanger components that caneffectively be adapted to meet the size requirements encountered forthese different devices. A thermal interface material (TIM) is typicallyused by practitioners to perform gap-filling functions (e.g. gels,greases, and thermal putties). However, this limits thermal transferefficiency. Improvements are therefore necessary in the current state ofthe art.

SUMMARY

According to one embodiment of the present invention, a method isprovided for constructing a heat exchanger for cooling one or moresemiconductor components. The method comprises the step of providingfirst and second planar sheets of specified thermally conductive metalfoil, wherein each of the sheets has an exterior side and an interiorside. The method further comprises forming one or more thermal contactnodes (TCNs) in the first sheet, wherein each TCN extends outward fromthe exterior side of the first sheet, and comprises a planar contactmember and one or more side sections. The side sections may respectivelyinclude resilient components that collectively enable the contact memberof the TCN to move toward and away from the exterior side of the firstsheet, and the side sections and contact member of a TCN collectivelyform a coolant chamber. A plurality of TCNs thus formed may accommodatedifferent device heights since each TCN can be formed with varyinggeometries and each TCN mechanically functions substantiallyindependently. Channel segments are configured along the interior sideof the first sheet and/or second sheet, wherein each channel segmentextends between the coolant chambers of two TCNs, or between the coolantchamber of a TCN and an input port or an output port, selectively. Themethod further comprises joining the interior side of the second sheetto the interior side of the first sheet, in order to form a sealed flowpath that includes each channel segment, and enables liquid coolant toflow into and out of the coolant chamber of each TCN. The method furthercomprises a connector means to couple and decouple coolant flow to/fromthe invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded perspective view showing an embodiment of theinvention, which includes two metal foil sheets of substantiallyidentical dimensions.

FIG. 2 is a perspective view showing the opposing side of one of thesheets depicted in FIG. 1.

FIG. 3 is a sectional view taken along lines 3-3 of FIG. 2.

FIG. 4 is a schematic view showing TCNs of the embodiment of FIG. 1 inengagement with respective semiconductor devices, to remove heattherefrom.

FIG. 5 is a schematic view showing a modification of the embodiment ofFIG. 1.

FIG. 6 is a schematic view showing a further modification of theembodiment of FIG. 1.

DETAILED DESCRIPTION

As will be appreciated by one skilled in the art, the present inventionmay be embodied as a system or method. Accordingly, the presentinvention may take the form of an entirely hardware embodiment, anentirely process embodiment (including design, fabrication, assembly anduse steps, etc.) or an embodiment combining method and hardware aspectsthat may all generally be referred to herein as a process or an“assembly” or a “system.”

Embodiments of the invention provide a method and apparatus for removingheat from semiconductor devices or components, such as those on a singlemodule or an entire PCB assembly. Embodiments enhance simplicity, reducecost, and may be readily adapted for use with multiple semiconductorcomponents that are adjacent to one another, but are of different sizesor dimensions from one another. Embodiments of the invention are alsoable to adapt to variations in height, or other critical dimension, thatcan occur among semiconductor devices of the same type.

Referring to FIG. 1, there is shown an exploded perspective view of anembodiment of the invention, which comprises a liquid flow through (LFT)heat exchanger for removing heat from multiple semiconductor devices orcomponents. The heat exchanger can be readily adapted for use withdevices that are adjacent to one another, but are of different sizes.FIG. 1 shows two rectangular, substantially planar metal foil sheets 10and 12, which usefully are of the same dimensions. Thus, the length andcross-section of sheet 10 are equal to the length and cross-section ofsheet 12, respectively. Metal foil sheets 10 and 12 are formed from amaterial that has high thermal conductivity, such as copper, a brassalloy, beryllium copper, (BeCu), aluminum, an aluminum alloy, orstainless steel. However, the invention is not limited thereto.

Each of the sheets 10 and 12 has an interior side, such as interior side12 a of sheet 12. The interior side 10 a of sheet 10 is shown in FIG. 2.Each sheet also has an exterior side, such as exterior side 10 b ofsheet 10. In fabricating the heat exchanger of FIG. 1, sheets 10 and 12are joined together so that interior sides 10 a and 12 a are maintainedin close abutting relationship with each other. It is also useful tojoin the two sheets so that their respective corresponding corners arealigned with one another, as shown in FIG. 1. However, before the sheetscan be joined together, it is necessary to form certain structural or3-dimensional features in the material of at least one of the sheets.These structural features will be determined by the particularconfiguration of semiconductor devices with which the heat exchanger ofFIG. 1 is to be used, to remove heat therefrom.

Referring further to FIG. 1, there are shown, by way of example and notlimitation, thermal contact nodes (TCNs) 14 and 16, which arerespectively formed in metal foil sheet 10 and are thus thermallyconductive. TCN 14 has a planar contact member 14 a, and TCN 16 has aplanar contact member 16 a. Member 16 a extends outward from exteriorside 10 b by some amount of spacing, and is supported with respect toside 10 b by side sections 16 b-16 e, which are respectively positionedalong the four sides of contact member 16 a. As described hereinafter infurther detail, each side section includes a rigid component and aresilient component. The rigid component is firmly joined to exteriorside 10 b of sheet 10. The resilient component is positioned between therigid component and member 16 a, to allow member 16 a to move or flextoward or away from side 10 b, that is, to move along the Z-axis.

Planar contact member 14 a is similarly supported for movement along theZ-axis by side sections 14 b-14 e, which are respectively positionedalong the four sides of contact member 14 a. Each side section 14 b-14 eis similar in construction and function to the side sections 16 b-16 e.

FIG. 1 also shows that planar contact members 14 a and 16 a are spacedapart from one another by a particular distance. This indicates that theheat exchanger of FIG. 1, after it has been fabricated, will be used tocool two semiconductor devices that are likewise spaced apart by theparticular distance separating members 14 a and 16 a. In addition, FIG.1 shows that contact member 16 a is significantly larger than member 14a. This indicates that the device with which TCN 16 will be used islarger, or needs a larger thermal contact surface area, than the devicewith which TCN 14 will be used.

As stated above, the provision of two TCNs as shown by FIG. 1 is onlyexemplary, and the invention is by no means limited thereto. Moregenerally, it is to be emphasized that the number of TCNs formed onsheet 10, as well as their respective sizes and positions, can bereadily adapted to meet the needs of many different applications forelectronic component heat removal. This capability emphasizes theflexibility which is provided by embodiments of the invention. Aparticular configuration of TCNs, designed for a particular application,can be fabricated by embossing or molding sheet 10, or by using othertechniques known to those of skill in the art.

In order to carry out a heat removal function, it is necessary toprovide a flow of coolant fluid to and away from each of the TCNs andtheir respective planar contact members 14 a and 16 a. Accordingly, inaddition to forming the TCNs 14 and 16 in sheet 10, a coolant flowchannel is also formed therein. More particularly, FIG. 1 shows channelsegments 18, 20, and 22 formed in sheet 10. Each of these segments has asemicircular cross section and is convex with respect to side 10 b ofsheet 10, that is, each segment extends outward therefrom. Channelsegment 18 extends from a channel end 18 a to TCN 16. Segment 20 extendsfrom TCN 16 to TCN 14, and channel segment 22 extends from TCN 14 to achannel end 22 a.

Referring to FIG. 2, there is shown interior side 10 a of sheet 10, thatis, the side thereof that is opposite to exterior side 10 b. FIG. 2further shows that the contact member 16 a and its side sections 16 b-16e of TCN 16 collectively form a chamber or compartment 24, which canreceive and contain liquid coolant fluid. An end 18 b of coolant channelsegment 18 is formed to access, or open into, the chamber 24. In likemanner, an end 20 a of channel segment 20 accesses or opens into chamber24.

Referring further to FIG. 2, it is seen that similar to TCN 16, thecontact member 14 a and side sections 14 b-14 e of TCN 14 collectivelyform a chamber 26 that can receive and contain coolant fluid. An end 20b of channel segment 20 and an end 22 b of channel segment 22 eachaccesses or opens into chamber 26.

Referring again to FIG. 1, it will be appreciated that when sheets 10and 12 are joined together as described above, chambers 24 and 26 willbe completely enclosed, except at the locations of access to the channelsegments. Moreover, the chambers 24 and 26 and the channel segmentscollectively comprise a system that is enclosed except at channel ends18 a and 22 a. By using one of the channel ends as an input port and theother as an output port, liquid coolant fluid can be selectivelycirculated through the channel segments, and through chamber 24 of TCN16 and chamber 26 of TCN 14.

In joining metal foil sheets 10 and 12 together, laser welding may beused to join regions of sheets 10 and 12 that surround or are proximateto TCNs 14 and 16, and also to channel segments 18-22. This will ensurethe formation of very tight seals for the fluid containing chambers 24and 26 and the channel segments. The edges of sheets 10 and 12 may bejoined by means of laser welding, or may alternatively be joined bymeans of an adhesive, or by a metallurgical process such as soldering.

FIG. 1 further shows small channel segments 28 and 30 formed in sheet12. Each of these channel segments has a semicircular cross section, andis convex with respect to interior side 12 a, that is, each channelextends away from sheet 10 as viewed in FIG. 1. Channel segments 28 and30 are positioned to mate with channel ends 18 a and 22 a, respectively,when sheets 10 and 12 are joined together. This provides each of thechannel segments 18 and 22 with a circular aperture at its opening.Couplings 32 and 34 are each sized and fitted to a corresponding one ofthese apertures. The couplings may then be connected to a conventionalcoolant fluid pump (not shown), with one of the couplings such as 34selected as the input port and the other as the output port. Byoperating the pump, liquid coolant fluid is circulated to each of theTCNs, as discussed above, for heat removal applications. The coolantfluid could comprise distilled water, or other fluid used by those ofskill in the art to remove heat from semiconductor devices.

Referring now to FIG. 3, there is shown a sectional view taken throughmetal foil sheet 10, along lines 3-3 of FIG. 2. FIG. 3 thus depictsfeatures of side sections 16 e and 16 c of TCN 16. More particularly,each of these side sections is shown to include a component 36, which iscomparatively rigid. That is, when TCN 16 was formed in sheet 10, eachof the side section components 36 was constructed so that it would notmove in relation to adjacent portions of sheet 10.

Referring further to FIG. 3, there is shown a component 38 attached toeach rigid component 36, and also attached to a side or edge of contactmember 16 a of TCN 16. In the formation of sheet 10, each component 38is fabricated in the manner of or to function as a bellows, so that itis capable of flexure or resilience. Contact member 16 a is thus able tomove toward or away from sheet 10, i.e., upward or downward or along theZ-axis, as viewed in FIG. 3. In the formation of sheet 10, the resilientcomponents 38 of a TCN are usefully provided with a prespecified springconstant, to permit elements of the TCN to be compressed or elongatedwithin the elastic limit of the sheet 10 material.

Side sections 16 b and 16 d, while not shown in FIG. 3, each comprises arigid component and a resilient component that are similar or identicalto rigid components 36 and resilient components 38, respectively.

Referring further to FIG. 3, there is shown side sections 14 e and 14 ceach comprising a rigid component 40 and a resilient component 42. Eachcomponent 40 is similar to components 36 and each component 42 issimilar to components 38, as described above. Accordingly, contactmember 14 a of TCN 14 is able to move along the Z-axis in the samemanner as contact member 16 a.

Side sections 14 b and 14 d, while not shown in FIG. 3, each comprises arigid component and a resilient component that are similar or identicalto those shown in FIG. 3 in connection with side sections 14 c and 14 e.

Referring to FIG. 4, there is shown a schematic view that illustratesthe use or operation of the embodiment described above to remove heatfrom semiconductor electronic devices. More particularly, FIG. 4 showssemiconductor devices 46 and 48 mounted on a PCB 44 or the like, whereincontact member 16 a of TCN 16 has been brought into contactingrelationship with device 46. Accordingly, heat from the device 46 istransferred to thermally conductive member 16 a, and through the member16 a to liquid coolant 50 contained in chamber 24. As described above,liquid coolant may be circulated through chamber 24, and thereby removesheat therefrom.

Similarly, FIG. 4 shows contact member 14 a of TCN 14 in contact withsemiconductor device 48, to remove heat therefrom and transfer the heatto coolant 50 in chamber 26.

It is to be appreciated that semiconductor devices 46 and 48 shown inFIG. 4 are distinctly different in size from each other. In view ofthis, TCNs 14 and 16 have likewise been constructed to be different fromone another, and each has been adapted to mate with its correspondingsemiconductor device. FIG. 4 thus further illustrates the flexibilitythat can be provided by embodiments of the invention to adapt todifferent cooling requirements. It is considered that any reasonablenumber of TCNs and channel segments can be formed in sheet 10, withconfigurations to meet particular arrangements of semiconductor devices.

To illustrate a further benefit provided by embodiments of theinvention, FIG. 4 shows semiconductor device 46 provided with a heightmark 46 a. This mark represents the minimum height that device 46 couldhave, and still be within its prespecified tolerance. FIG. 4 furthershows that device 46 exceeds the minimum height requirement 46 a, by anamount Δ. However, by constructing TCN 16 as described above, theresilient components 38 enable contact member 16 a to be adjusted oroffset by the same amount Δ, while remaining in close contact withdevice 46 to provide effective heat transfer. As viewed in FIG. 4,member 16 a is moved upward by the amount Δ, to accommodate the heightby which component 46 exceeds its minimum allowable height. At the sametime, the resiliency of components 38 prevent device 46 or TCN 16 frombeing subjected to undue stress, and avoids exceeding elastic limitsthereof.

In a modification of the embodiment shown in FIG. 1, one or more TCNsand channel segments, having features similar to those described abovein connection with sheet 10, may also be formed in sheet 12. Theresulting modified heat exchanger could then be placed between twoconfigurations of semiconductor devices, with one configuration beingcooled by the TCN's of sheet 10, and the other configuration by theTCN's of sheet 12.

In a further modification, before or after forming any TCNs or channelsegments, the interior sides of both sheets 10 and 12 would be coatedwith a metal referred to as a barrier metal. This metal does not reactwith the liquid that is to be used as the coolant fluid. Use of thebarrier metal thus reduces interior corrosion of the heat exchanger.

In yet another modification, the cross-sections of one or more channelsegments could be made larger than the cross-sections of other sections,to increase the rate at which coolant flows away from a particular TCN.For example, if coolant is flowing from channel end 22 a, throughrespective channel segments and TCNs 14 and 16 to channel end 22 a, thediameter of channel segment 18 could be made greater than the diameterof segment 22. This would increase the rate at which coolant flowed awayfrom TCN 16, and would thus increase the capacity of TCN 16 to dissipateheat. As an alternative, two or more channel segments could be formed insheet 10, to carry heat away from TCN 16.

Referring to FIG. 5, there is shown a TCN 52 similar to TCNs 14 and 16.TCN 52 thus comprises a planar contact member 52 a and side sections 52b-52 e which collectively form a coolant chamber. In a modification ofthe invention, structure 54, comprising a series of waves, or hills andvalleys is formed as part of TCN 52 that is, integral with othercomponents of TCN 52 or in situ. Structure 54 is therefore contained inthe coolant chamber of TCN 52, and is formed integral with and supportedupon member 52 a.

By placing the structure 54 in the coolant chamber of TCN 52, coolantflowing through the chamber will become quite turbulent. Thisturbulence, in turn, will cause the fluid to be much more effective indissipating heat that has been transferred to fluid in the chamber, froma semiconductor device in contact with member 52 a.

Referring to FIG. 6, there is shown a TCN 56 similar to TCNs 14 and 16.TCN 56 thus comprises a planar contact member 56 a and side sections 56b-56 e which collectively form a coolant chamber. In a furthermodification of the invention, structure 58, similar to structure 54 ofFIG. 5, comprises a series of waves, or hills and valleys. However,structure 58 is formed independently of TCN 56, and is placed into thecoolant chamber of TCN 56 after TCN 56 has been formed. Structure 58causes turbulence of the coolant in the chamber of TCN 56, in likemanner with structure 54.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

The corresponding structures, materials, acts, and equivalents of allmeans or step plus function elements in the Claims below are intended toinclude any structure, material, or act for performing the function incombination with other Claimed elements as specifically Claimed. Thedescription of the present invention has been presented for purposes ofillustration and description, but is not intended to be exhaustive orlimited to the invention in the form disclosed. Many modifications andvariations will be apparent to those of ordinary skill in the artwithout departing from the scope and spirit of the invention. Theembodiment was chosen and described in order to best explain theprinciples of the invention and the practical application, and to enableothers of ordinary skill in the art to understand the invention forvarious embodiments with various modifications as are suited to theparticular use contemplated.

The invention can take the form of an entirely hardware embodiment, anentirely method embodiment or an embodiment containing both hardware andmethod elements. In a preferred embodiment, the invention is implementedin process, which includes but is not limited to real components andparts and specific process steps to design, fabricate and utilize theinvention.

The description of the present invention has been presented for purposesof illustration and description, and is not intended to be exhaustive orlimited to the invention in the form disclosed. Many modifications andvariations will be apparent to those of ordinary skill in the art. Theembodiment was chosen and described in order to best explain theprinciples of the invention, the practical application, and to enableothers of ordinary skill in the art to understand the invention forvarious embodiments with various modifications as are suited to theparticular use contemplated.

1. A method for constructing a heat exchanger for cooling one or moresemiconductor components, said method comprising the steps of: providingfirst and second planar sheets of specified thermally conductive metalfoil, wherein each of the sheets has an exterior side and an interiorside; forming one or more thermal contact nodes (TCNs) in the firstsheet, wherein each TCN extends outward from the exterior side of thefirst sheet, and comprises a planar contact member and one or more sidesections, the side sections and contact member of a TCN collectivelyforming a coolant chamber; configuring channel segments along theinterior side of the first sheet, wherein each channel segment extendsbetween the coolant chambers of two or more TCNs, or between the coolantchamber of a TCN and an input port or output port, selectively; andjoining the interior side of the second sheet to the interior side ofthe first sheet, in order to form a sealed flow path that includes eachchannel segment, and enables liquid coolant to flow into and out of thecoolant chamber of each TCN.
 2. The method of claim 1, wherein: the sidesections of at least one of said TCNs respectively include resilientcomponents that collectively enable the contact member of the TCN tomove toward and away from the exterior side of the first sheet.
 3. Themethod of claim 1, wherein: a plurality of TCNs are formed in said firstsheet, wherein each TCN has a dimension measured along a Z-axis that isorthogonal to said first sheet, and the Z-axis dimension of one of saidTCNs is different from the Z-axis dimension of another of said
 4. Themethod of claim 1, wherein: the resilient component of each of said sidesections comprises a bellows structure.
 5. The method of claim 1,wherein: one or more TCNs are formed in the second sheet, wherein eachTCN formed in the second sheet extends outward from the exterior side ofthe second sheet, and comprises a planar contact member and one or moreside sections.
 6. The method of claim 1, wherein: the cross-section ofone or more of said channel segments is made different from thecross-section of one or more other channel segments in order to causesaid coolant to flow out of the coolant chamber of at least one of saidTCNs at a different rate than it flows out of the coolant chamber ofanother of said TCNs.
 7. The method of claim 1, wherein: selectedstructure is placed in a given coolant chamber, to cause turbulence ofcoolant flowing through the given coolant chamber.
 8. The method ofclaim 1, wherein: said TCNs and channel segments are formed in the firstsheet by means of an embossing process.
 9. The method of claim 1,wherein: a laser welding process is used to join said first and secondsheets together at regions that respectively surround each of said TCNsand each of said channel segments.
 10. The method of claim 1, wherein:prior to forming said TCNs and configuring said channel segments, theinterior sides of said first and second sheets are each coated with aselected barrier metal that does not react with said coolant.
 11. Themethod of claim 1, wherein: said channel segments and coolant chamberscollectively define a path of flow for said coolant from said input portto said output port.
 12. Heat exchanger apparatus for cooling one ormore semiconductor components, said apparatus comprising: a first planarsheet of specified thermally conductive foil that has an exterior sideand an interior side, wherein one or more thermal contact nodes (TCNs)are formed in the first sheet, each TCN extending outward from theexterior side of the first sheet and comprising a planar contact memberand one or more side sections, the side sections respectively includingresilient components that collectively enable the contact member of theTCN to move toward and away from the exterior side of the first sheet,the side sections and contact member of a TCN collectively forming acoolant chamber, and a channel segment is configured along the interiorside of the first sheet, wherein each channel segment extends betweenthe coolant chambers of two or more TCNs, or between the coolant chamberof a TCN and an input port or an output port, selectively; a secondplanar sheet of said specified thermally conductive foil that has anexterior side and an interior side; and means for joining the interiorside of the second sheet to the interior side of the first sheet, inorder to form a sealed flow path that includes each channel segment, andenables liquid coolant to flow into and out of the coolant chamber ofeach TCN.
 13. The apparatus of claim 12, wherein: the resilientcomponent of each side section comprises a bellows structure.
 14. Theapparatus of claim 12, wherein: the cross-section of one or more of thechannel segments is made different from the cross-section of at leastone or more other channel segments, in order to cause said coolant toflow out of the coolant chamber of one or more of said TCNs at adifferent rate than it flows out of the coolant chamber of another ofsaid TCNs.
 15. The apparatus of claim 12, wherein: selected liquid flowturbulence structure is placed in a given coolant chamber, to causeturbulence of coolant flowing through the given coolant chamber in orderto increase the thermal transfer efficiency of the TCN.
 16. Theapparatus of claim 12, wherein: said TCNs and channel segments areformed in the first sheet by means of an embossing process.
 17. Theapparatus of claim 12, wherein: prior to forming said TCNs andconfiguring said channel segments, the interior sides of the first andsecond sheets are each coated with a selected barrier metal that doesnot react with said coolant.
 18. A method for constructing a heatexchanger for cooling one or more semiconductor components, said methodcomprising the steps of: providing first and second planar sheets ofspecified thermally conductive metal foil, wherein each of the sheetshas an exterior side and an interior side; forming one or more thermalcontact nodes (TCNs) in the first sheet, wherein each TCN extendsoutward from the exterior side of the first sheet, and comprises aplanar contact member and one or more side sections, the side sectionsand contact member of a TCN collectively forming a coolant chamber;configuring channel segments along the interior side of the first sheet,wherein each channel segment extends between the coolant chambers of twoor more TCNs, or between the coolant chamber of a TCN and an input portor output port, selectively; joining the interior side of the secondsheet to the interior side of the first sheet, in order to form a sealedflow path that includes each channel segment, and enables liquid coolantto flow into and out of the coolant chamber of each TCN; an inputcoolant connector joined to said input port for receiving coolant from acoolant circulating mechanism; and an output coolant connector joined tosaid output port for returning coolant to the coolant circulatingmechanism.
 19. The method of claim 18, wherein: a first one of said TCNsis adapted to contact a first semiconductor component, and a second oneof said TCNs is adapted to contact a second semiconductor component,wherein said first and second semiconductor components are adjacent toeach other, and have respective height dimensions that are differentfrom each other.
 20. The method of claim 18, wherein: the side sectionsof at least one of said TCNs respectively include resilient componentsthat collectively enable the contact member of the TCN to move towardand away from the exterior side of the first sheet.